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ASAP-1 Selected Area Preparation System
Backside Preparation & Polsihing / Mechanical Decapsulation

ASAP-1 product brochure - 12 page (1.6M) PDF file

View Several video tutorials regarding the operation of the ASAP-1 (opens new window).

The ability to produce accurate, reproducible, thinned dice for backside analysis is now available for every laboratory. Flip-chip and power chip mechanical decp is now straightforward and accurate.

The die, whether in packaged or wafer form, is mounted on a specially designed traveling table oscillates within X and Y direction limits set by the user.

Utilizing a rotating tool, controlled in the Z-Direction, accurate, reproducible back-grinding can be carried out to a specific thickness (routinely to less than 50mm of remaining silicon), finishing with a scratch-free mirror polish. This yields a surface ready for imaging and backside microscopy.

By changing tools, in conjunction with loose or fixed abrasives, a scratch-free surface is produced. Heating of the substrate is minimal during processing due to the extreme low damage nature of the process. The process also improves yields.

Product highlights

• All sizes of die can be prepared -- package and wafer-level
• Low damage method allows for extremely thin samples
• Accurately removes material and then polishes
• ASAP-1 is intuitive and easy to use.
• Short set-up and process times
• Also provides key advantages for decapsulation applications (for example on BGA, flip chip, power device, MCM package styles)
• ‘Die tilt' is accommodated during the process
• Bench-top and quiet in operation

Find out about the ARC-lite Anti-Reflective Coating System for backside analysis

Find out about the INFRATEC-1 Backside Microscope for validation of backside sample prep & substrate thickness